Creative Edge Software to Introduce iC3D ‘Bump Displacement’ Feature to the US Market
March 15, 2017 – Creative Edge Software, developer of the award-winning iC3D packaging design software, announces its attendance at the Eastern Winery Expo. The event takes place March 22nd – 24th at the Oncenter in Syracuse, NY and iC3D will be exhibiting at booth 1215. This will be the first showing in the Americas of the latest iC3D release including new feature Bump Displacement, which enables designers to create unique 3D shapes and surfaces for premium and luxury packaging effects.